Copper Tungsten(Cu-W) Plate

The manufacturing process of copper tungsten typically involves powder metallurgy techniques. The powdered copper and tungsten are mixed in the desired ratios and then compacted under high pressure. The compacted material is subjected to a sintering process, where it is heated to a temperature below the melting point to bond the particles together. Additional processing steps, such as hot pressing or infiltration, may be employed to achieve specific properties and shapes.
The properties of copper tungsten can be tailored by adjusting the composition. The tungsten content in the alloy affects its hardness, electrical conductivity, and thermal conductivity. Higher tungsten content increases hardness and wear resistance but decreases electrical and thermal conductivity. Conversely, higher copper content enhances electrical and thermal conductivity but reduces hardness.
As copper and tungsten shall not really melt together, Cu-W is produced by powder metallurgy. Due to the high electric conductivity and relatively high max. working temperature of this material, copper-Tungsten plate is usually used in electric component, such as electrodes.

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