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Overview
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The aluminum-copper (Al/Cu) system is a widely used material combination in microelectronics and optoelectronics. Copper, with its high electrical and thermal conductivity, is often used as the interconnect material, while aluminum serves as the contact and metallization layer. This combination provides efficient charge transport, good thermal management, and reliable electrical connections in integrated circuits, microprocessors, and other electronic devices. The ability to deposit and pattern Al/Cu thin films using well-established semiconductor fabrication techniques, such as sputtering, enables the integration of these materials in advanced device architectures.
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