Pyrolytic Boron Nitride Plate | PBN Plate

Pyrolytic Boron Nitride Plate | PBN Plate

Catalog Number:
CM02502461QSA
Mfr. No.:
QSA240024AM
Price:
  • Size:
    2.1 g/cm³
    Quantity:
    Add to Cart:
      • Overview
        • Pyrolytic boron nitride (PBN) sheets are made using a chemical vapor deposition (CVD) process. The process involves the thermal decomposition of a gas mixture containing boron and nitrogen under controlled conditions. The process starts by placing a substrate, typically a graphite or silicon carbide material, into a reaction chamber. The substrate is heated to a high temperature, usually above 1800°C, and a gas mixture containing boron and nitrogen is introduced into the chamber. The gas mixture can include boron trichloride (BCl3) and ammonia (NH3), which react to form boron nitride (BN).
          As the gas mixture flows over the substrate, the boron and nitrogen atoms react to form a thin film of boron nitride on the substrate surface. The process is repeated multiple times to build up the thickness of the boron nitride film to the desired thickness.

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      • Properties
        • Categories
          Boron Nitride (BN)
          Other Properties
          Material: Pyrolytic Boron Nitride /PBN
          Production process: CVD
          Purity: >99.99%
          Chemical formula: BN
          Crystal structure: Hexagonal
          Density: 2.1 g/cm³
          Melting point: Does not melt
          Coefficient of thermal expansion: 1.0-1.5 ×10^-6/K
          Hardness: 4 Mohs
          Refractive index: 1.8-1.9
          Thermal conductivity: 25-200 W/(m·K)
          Electrical resistivity: >10^14 Ω·cm
          Dielectric constant: 3.5-4.0
          Stability: >2000C in inert
      • Applications
        • Application Description
          The resulting PBN sheets have excellent thermal and electrical properties, making them useful in a variety of high-temperature applications, such as semiconductor processing, aerospace, and nuclear industries. PBN sheets are also highly resistant to chemical attack and have low thermal expansion coefficients, making them suitable for use in harsh environments.

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