Aluminum Copper Silicon (AlSiCu) Sputtering Target

AlSiCu is a ternary alloy composed of aluminum, silicon, and copper. This material is commonly used as a metallization layer in integrated circuits and semiconductor devices. The addition of silicon and copper to aluminum improves the alloys mechanical strength, electromigration resistance, and thermal stability, which are crucial for reliable interconnect and contact formation. AlSiCu can be deposited using techniques like physical vapor deposition or chemical vapor deposition, including sputtering, and subsequently patterned using photolithography and etching processes. The versatility of this material system makes it a key component in the fabrication of high-performance microelectronic and optoelectronic devices.

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