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SEPLITE® Monojet™ LSC7105 Chelating Resin

SEPLITE® Monojet™ LSC7105 Chelating Resin

Catalog Number:
CR03110694SUN
Mfr. No.:
LSC7105
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    • Overview

      • SEPLITE® Monojet™ LSC7105 is a macroporous chelating resin with iminodiacetate active group which was specifically designed for the Printed Circuit Board and Metal processing industries.
        Its iminodiacetic acid functional group is obtained with a proprietary aminomethylation route making allowing very high Total Capacity and exceptional selectivity and lowest leakage for the recovery of metals.
        The macroporous uniform particle size polymer beads, with a very low uniformity coefficient of less than 1,1 offer excellent separation performance and have been optimized to improve the operating capacity of this product. The polymer structure provides also for an excellent chemical and physical stability versus both osmotic and thermal shocks.

        Please contact us at for specific academic pricing.

    • Properties
      • Categories
        Macroporous, weak acid, Chelating iminodiacetate Resin
        Other Properties
        Matrix Structure: Polystyrene DVB, Macroporous
        Functional group: Iminodiacetic
        Shipping form: Na+
        Physical Appearance: Gray to light yellow spheres
        Particle range (mm): 0.45-0.55 (≥95%)
        Moisture Content (%): 45-55
        Bulk Density (g/l): 700-800
        Density (g/l): 1150-1250
        Total capacity (eq/L): ≥2.5
        Uniformity coefficient: ≦1.1
        Volume change Na-H (Max.): -30%
        Note
        Resins should be stored in sealed containers or bags where temperature was above 0°C in dry conditions without exposure to direct sunlight. Do not mix ion exchange resin with strong oxidizing agents; otherwise it will cause violent reactions.
        In case of eyes contact with resins, rinse eyes immediately with plenty of water, and consult a specialist. Material and samples must be disposed according to local regulations.
        Dry polymers will expand when become wetted and may cause an exothermic reaction. Spilled materials may be slippery.
    • Applications
      • Application
        Printed Circuit Board Industries

Documents

Resin Product Catalog

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