Nickel Nitride (NiN) Sputtering Target

Nitride is a binary compound formed by nitrogen and an element with less electronegativity than it. The nitride formed by the direct combination of transition elements and nitrogen is also called metallic nitride. They belong to "interstitial compounds", so named because nitrogen atoms occupy interstitial positions in the metal lattice. This compound is similar to metal in appearance, hardness and conductivity. Generally, it has high hardness, high melting point, stable chemical properties, and conductivity. Nitrides of titanium, vanadium, zirconium, and tantalum are hard and refractory, and are resistant to chemical corrosion and high temperature.
Sputtering technique are frequently used to create a thin film of Nickel Nitride. The NiN target material is placed on the electrode in the sputtering chamber. Heavy ion particle or laser are frequently used to ejecting coating material from the target, made by Nickel Nitride in this case, to create a thin film of NiN on the surface of the substrate.

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