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Introduction
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Any material: silver, gold, copper, graphene, polymer…
Any surface : Si, SiO2, Si3N4 Wafers, Glass, Flexible substrate, etc.
Any desired shape : lines, circles, gratings, dots, 3D pillars, etc.
Resolution & precision: 500 nm to tens of µm resolution range.
16 cm deposition span, accommodating up to 25 cm wide substrates.
Exceptional Positioning
Accuracy: <100nm in XY, 5 nm in Z.
Print speed: < 10mm/s seamlessly.
Simplicity: Streamlined printing workflow featuring automated calibration.
Real-time Monitoring: Leverage a high-magnification camera and user-friendly software designed for direct oversight.
Key Features:
· Unlock manufacturing possibilities
Our machine allows you to unlock new manufacturing possibilities, such as:
Unprecedented resolution
Precision
Large process window (ink, substrate, shape, size)
· Internalize research and production
Limited footprint
Low manufacturing costs
High production yield
· User-oriented equipment
High process control (in situ monitoring, automatic adaptation to substrates)
On-demand consumables
· Easy to use and reliable software
Easy-to-use software
Our dedicated software suite, developed internally, seamlessly supports both research and production tasks. With its user-friendly interface, users can easily draw new patterns, adjust pipette size, switch inks, monitor performance, and characterize samples with integrated AFM capabilities.
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Introduction
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Manual