Copper Tungsten (Cu-W) Sputtering Target

Tungsten Copper (W-Cu) is a composite material composed of tungsten (W) and copper (Cu). It combines the high melting point and hardness of tungsten with the excellent thermal conductivity of copper. Tungsten copper exhibits high melting point and hardness along with good thermal conductivity. When used as a sputter target in the electronics industry, W-Cu is commonly employed for packaging and electrode materials. Due to its thermal expansion coefficient similar to materials such as silicon, silicone, and ceramics, tungsten copper is frequently utilized in electronic packaging.
As a composite material rather than a true alloy, W-Cu cannot be produced using conventional melting furnaces due to tungsten's extremely high melting point.

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