Copper Sulfide (CuS) Sputtering Targets

Copper Sulfide (CuS) Sputtering Targets

Catalog Number:
ST01502826QSA
Mfr. No.:
DPSF29ST-2
Price:
$1,158
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      • Overview
        • Sputtering technique are frequently used to create a thin film of Copper Sulfide . The CuS target material is placed on the electrode in the sputteringchamber. Heavy ion particle or laser are frequently used to ejecting coatingmaterial from the target, made by Copper Sulfide in this case, to create athin film of CuS on the surface of the substrate.

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      • Properties
        • Categories
          High Purity Materials
          CAS Number
          1317-40-4
          Molecular Formula
          CuS
          Other Properties
          Composition: Copper Sulfide (CuS)
          Purity: 99.9% ~ 99.999%
          Max. dia. of flat disc sputter target: 8"
          Typical lead time of CuS sputtering target: 5 weeks

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