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Copper Sulfide (CuS) Sputtering Targets

Copper Sulfide (CuS) Sputtering Targets

Catalog Number:

ST01502826QSA

Mfr. No.:

DPSF29ST-2

Price:

$1,158

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Quantity:

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- Overview
  - Sputtering technique are frequently used to create a thin film of Copper Sulfide . The CuS target material is placed on the electrode in the sputteringchamber. Heavy ion particle or laser are frequently used to ejecting coatingmaterial from the target, made by Copper Sulfide in this case, to create athin film of CuS on the surface of the substrate.
    
    Please contact us at for specific academic pricing.
- Properties
  - Categories
    
    High Purity Materials
    
    CAS Number
    
    1317-40-4
    
    Molecular Formula
    
    CuS
    
    Other Properties
    
    Composition: Copper Sulfide (CuS)
    Purity: 99.9% ~ 99.999%
    Max. dia. of flat disc sputter target: 8"
    Typical lead time of CuS sputtering target: 5 weeks

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