Copper aluminum bimetallic LiB terminal

Compared with regular cold rolled copper aluminum bimetallic material, our casting rolled bimetal material has much better contact surface. As the aluminum is still in molten status when contact with copper, the connection strength is a lot higher than mechanical bond. Furthermore, there are fewer aluminum oxides. After years of optimization, the thickness of brittle copper-aluminum eutectic layer has been reduced to less than 2um in our material, which has very little effect on the mechanical strength of the copper aluminum bimetallic LiB terminal. As a result, our casting rolled copper aluminum bimetallic plates has perfect joint rate and great electrical and thermal conductivity.

Please contact us at for specific academic pricing.