Cobalt (Co) Sputtering Targets

Sputtering is a widely-used method in thin film deposition, employing a physical vapor deposition (PVD) process where atoms are ejected from a solid target material due to bombardment of the target by energetic particles. In the case of a cobalt sputtering target, high-purity cobalt is used as the target material. The process begins by creating a plasma in the sputtering chamber, typically with argon gas. Ions from the plasma are accelerated towards the cobalt target with sufficient energy to dislodge cobalt atoms from the target surface. As these cobalt atoms are ejected, they travel across the vacuum chamber and deposit onto a substrate, forming a thin film with the desired properties. The sputtering conditions, including the power applied to the target, vacuum level, and gas composition, are meticulously controlled to achieve the required film characteristics, such as thickness, uniformity, and crystal structure.

Please contact us at for specific academic pricing.