Spray Developing Machine

Cat. No. Dimensions (WxDxH) Specification Unit Price Quantity
MFSE528093-01 410 × 410 × 350 mm Speed: 0~400 RPM Each Inquiry

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Product Description
Product Description
The spray developing machine (WH-PXY-01) is a product with independent intellectual property rights. It is designed and developed for the development process in the photolithography process and can be used for silicon wafers with specifications below 5 inches. Carry out program-controlled automatic development. This equipment can completely replace the manual development link in the production process of microfluidic chips, and overcome the uncontrollable amount of developer added in the manual development process, uncontrollable silicon wafer development time, and uncontrollable development effect between silicon wafers of the same specification. It reduces the development quality problems caused by the operator's human factors and the damage of the silicon wafer.
Specifications
Speed: 0~400 RPM
Liquid volume control: 10~500mL
Adaptable silicon wafer/chip: 3 inches, 4 inches, 5 inches
Developing time: 0~900s
Inlet speed: 0~100%
Power input: AC220V±10V/50HZ
Power: 100W
Weight: 20 kg
Dimensions: 410 (W) * 410 (D) * 350 (H) mm
Working environment: temperature 0°C-40°C, relative humidity<80%
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