PDMS Mixed Defoaming Curing Processing Equipment

Cat. No. Dimensions (WxDxH) Specification Unit Price Quantity
MFSE528095-01 660×470×430 mm Available chip thickness: 0~20 mm Each Inquiry

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Product Description
Product Description
The PDMS hybrid defoaming and curing integrated machine (WH-HTG-01) has independent intellectual property rights. It is developed for the production of PDMS chips in laboratories in the field of microfluidic chips. It completely replaces manual operations and realizes full automation. It has the three functions of mixing, defoaming and curing of PDMS prepolymer A and B components, and can be automatically Define the mixing ratio, working temperature, vacuum, and working time. The setting of double stations improves the production efficiency of PDMS chips per unit time. It can be produced in a single piece or two pieces at the same time. The negative pressure degassing and high temperature curing can be simultaneous It can also be operated separately.
Specifications
Overall dimensions: 660×470×430 (length×width×height) mm
Number of stations: double station
Available chip size: within 5 inches
Available chip thickness: 0~20mm
Heating temperature: room temperature ~ 120°C
Negative pressure limit: 0.2*10-1 Pa
Rated power: 1.0KW
Rated voltage: AC220V/50HZ
Equipment weight: 40kg
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