Vacuum Hot Pressing Bonding for Thermoplastic Polymer Microfluidics

WH-2000A Vacuum thermocompression bonder for Hard plastic chips is developed for the bonding of rigid plastic chips such as PMMA, PC, COC, etc. It is a hard plastic microfluidic chip processing Professional setting.

· The use of constant temperature control heating technology, precise temperature control.
· Aluminum work platform, the upper and lower surface formation, heat conduction speed, thermal conductivity are uniform.
· Heating area, covering the commonly used size chip.
· Air cooling, cooling rate uniform, help to improve the bonding effect.
· The pressure is precisely adjustable, different pressure control for different materials.
· A unique vacuum hot pressing system, the chip is not damaged in the case of greatly improve the bonding.

Used for bonding hard plastic chips such as PMMA, PC, COC, etc., it is the first special equipment for processing hard plastic microfluidic chips at home and abroad.